Reel Service Ltd is the largest semiconductor, electro-mechanical and mechanical component finishing service and materials provider in Europe providing complete component solutions for device manufacturers, distributors, contract assembly providers and end users.

Services provided include Tape & Reel of standard outline SMD devices & Tape & Reel of non-standard devices connectors\etched parts\stampings etc ; wafer level CSP/Die processing including mounting to film frame, dicing, inspection and tape and reel or waffle packing; device programming, laser marking, bake & dry pack and component preparation, lead crop & form. 

Quality is our main focus in achieving customer satisfaction, achieved through zero defect policies, operational excellence, people and state-of-the-art equipment. The facility operates in accordance with ISO9001:2015 requirements.

Tape & Reel

Tape & Reel of:  Standard SMD Devices, Non-Standard Devices & Wafer Level/CSP


Bare Die Tape & Reel

Tape & Reel of Bare Die, Wafer Level Chip Scale Packages (CSP), Flip Chip & FR4 etc


Device Programming

Programming Service for MicroControllers, Flash, EEPROM, PLD etc


Laser Marking

Custom YAG & Fiber Laser Marking of Devices Supplied in Tray, Tube or Bulk/Loose Format


Bake & Dry Pack

Dehydration Bake & Vacuum Packaging Services


Component Preparation

Custom Lead Forming and Lead Cropping to Customer Specifications