Services provided include Tape & Reel of standard outline SMD devices & Tape & Reel of non-standard devices connectors\etched parts\stampings etc ; wafer level CSP/Die processing including mounting to film frame, dicing, inspection and tape and reel or waffle packing; device programming, laser marking, bake & dry pack and component preparation, lead crop & form.
Quality is our main focus in achieving customer satisfaction, achieved through zero defect policies, operational excellence, people and state-of-the-art equipment. The facility operates in accordance with ISO9001:2015 requirements.