Equipment
Semiconductor Technologies & Instruments Pte Ltd (STI) provide class leading, fast & innovative semiconductor back-end equipment solutions for Tape & Reel, Mark and Lead/ Ball Inspection & Reject Management. STI’s extensive range of flexible systems offer automated inspection, sorting and packing solutions utilising all popular input & output media, Plastic Tube, Metal Magazine, JEDEC Tray, Wafer Frame, Waffle Pack, Gel Pak, Tape & Reel. STI’s machines also provide unsurpassed flexibility allowing various combinations of both input & output media formats providing flexible cost effective investments. STI's expertise includes:
Wafer-Level Chip Scale Packaging Inspection & Sort
The iSort Express die sorting & taping system offers 3D bump inspection, Package Visual Inspection (PVI) and Active Die Inspection integrated into a class-leading die sorting platform.
These added features combine to provide a streamlined and efficient process flow, not only enhancing quality assurance, but also offering the lowest cost of ownership.
This intelligent system sorts dies into tape & reel with precision and high speed with UPH up to 20,000. Devices can also be placed onto Standard JEDEC trays or waffle trays.
Wafer inspection tool or die sorting system, the choice is yours.
Tray Based Tape & Reel
Top Package Visual Inspect (PVI) with orientation checking and correction
Bottom PVI
3D On-The-Fly Lead / Ball Inspection
Symbol Inspection
In-pocket Inspection
Dual Tape & Reel
The Hexa Evo is an integrated tool combining In-Tray Scanning & Taping functions into a single platform. It also features up to 6 semiconductor back-end processes into a compact system. This leadership product not only provides the highest throughput for tray & taping output, its comprehensive Package Visual Inspection (PVI) capabilities ensure that outgoing quality specifications are never compromised. Adopting STI’s proprietary 3D OTF “On-the-Fly” Laser and 2D Camera technologies in tandem allows for inspection to be carried out with devices in “live-bug” orientation. This eliminates the risk of device dropping during tray-flip for “dead-bug” presentation required in conventional machines. The dual taper design maximises machine utilisation as production is uninterrupted during material changeover. Hexa Evo offers class-leading UPH up to 50,000
The TR48Mk5 High Speed Tray to Tape System continues the legacy of the ever popular field proven TR48 series of machines with the latest Mk5 model which offers throughput up to 14,000 achieved through 3 pick & place heads with motorised On-the-Fly head pitch adjustment. The TR48 Mk5 combines high performance with ease of operation and includes STI's field-proven Integra Vision inspection system providing 2D lead & mark In-Pocket inspection with auto-sort reject management ensuring maximum machine throughput.
The TR48 Mk5 also features STI's latest icon based GUI providing a simple and efficient operator interface.
Turret Systems
STI's fast & reliable turret platform has evolved again to provide the AT468 high-speed multi-function scan-pack handler, engineered to provide maximum throughput for both leaded and leadless packages.
The fully automated design consists of a primary 24-station rotary turret coupled with a secondary multi-station inspection table for top side inspections. The flexible modular concept allows for media transfer flexibility, supporting a wide range of Input/ Output configurations.
Integrated electrical test is also available as an option.
The AT468 also includes full integration of STI's field-proven powerful Integra Vision inspection system providing 2D & 3D inspection for leaded & leadless packages along with optional top & bottom PVI inspection, topside mark inspection, and side inspections making it a true six side inspection system. In-Pocket inspection & Post-seal inspection available as options.
The AT468 also features STI's latest icon based GUI which is accessible via a touch screen providing an easy to use, simple and efficient operator interface.
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***Please note that this product is temporarily unavailable***
Prevent a stock shortage and line-down situation by using the IC63 Component Counter to verify exact stock quantities of all your reeled components.
The IC63 Component Counter allows you to accurately count taped components in an effective and efficient manner without inducing damage to the components or carrier tape. Counting can also be performed in both winding directions.
In addition to its primary function as a component counter, the IC63 can also be simultaneously used to assist with the visual inspection of the components in tape and the quality of the tape seal if desired while winding the tape from reel to reel.
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Reel Service offer a flexible range of vacuum packaging machines that may be configured for a variety of industries, from semiconductors & electronics to food industry standards. To protect parts in storage or transport these machines vacuum package and heat seal to provide optimum atmospheric conditions for product preservation.
To provide ESD (Electro Static Discharge) protection, our range of vacuum packaging machines can be specified with an ESD option (certified to DIN EN 61340-5-1:2001) to ensure that ESD sensitive components, assemblies and PCB’s are vacuum packed within a static safe environment.
When used with appropriate barrier bags, vacuum packaging protects bag contents against physical damage, dust, ultra violet radiation (UV), radio frequency (RF) contamination, ESD, humidity, oxidisation and corrosion.
All machines are compatible with antistatic aluminium foil type moisture barrier bags.
Datasheets
Table-Top Vacuum Packaging Machines - datasheet available here
Models available with ESD option - datasheet available here
Floor Standing Vacuum Packaging Machines - datasheet available here
Double Chamber Vacuum Packaging Machines - datasheet available here
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